Thermal measuring and testing – Temperature measurement – By electrical or magnetic heat sensor
Reexamination Certificate
2005-11-08
2005-11-08
Fulton, Christopher W. (Department: 2859)
Thermal measuring and testing
Temperature measurement
By electrical or magnetic heat sensor
C374S141000
Reexamination Certificate
active
06962437
ABSTRACT:
A thermal measurement device for obtaining accurate thermal profiles during flip-chip semiconductor packaging and methodologies for making such devices is disclosed. Particularly, a measurement device comprised of a thermocouple sandwiched between a semiconductor packaging substrate and a semiconductor die. Such a device providing increased accuracy in temperature measurement. The present invention also teaches a packaging substrate assembled with a semiconductor die having an opening in the substrate enabling the placement of a thermocouple such that it is in contact with the die and secured in place. Additionally, methods of constructing the devices of the present invention are disclosed.
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Rajagopalan Sarathy
Vuong Minh
Fitch Even Tabin & Flannery
Fulton Christopher W.
Guadalupe Yaritza
LSI Logic Corporation
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