Data processing: structural design – modeling – simulation – and em – Simulating electronic device or electrical system
Reexamination Certificate
2008-06-11
2011-12-20
Rodriguez, Paul (Department: 2123)
Data processing: structural design, modeling, simulation, and em
Simulating electronic device or electrical system
C716S136000
Reexamination Certificate
active
08082137
ABSTRACT:
A method and apparatus for modeling and thermal analysis of semiconductor chip designs is provided. One embodiment of a novel method for performing thermal testing of a semiconductor chip design includes calculating full-chip temperatures over the semiconductor chip design (e.g., to identify steep thermal gradients) and modeling the full-chip temperatures in accordance with a geometric multi-grid technique. The geometric multi-grid technique is tailored to determine temperatures within the semiconductor chip design based at least in part on the physical attributes or geometry of the design.
REFERENCES:
patent: 2004/0133408 (2004-07-01), Verdyck
Wang et al. (3-D Thermal-ADI: A Linear-Time Chip Level Transient Thermal Simulator, IEEE Dec. 2002).
Asheghi Mehdi
Chandra Rajit
Li Peng
Pileggi Larry
Gradient Design Automation Inc.
Louis Andre Pierre
Rodriguez Paul
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