Data processing: measuring – calibrating – or testing – Measurement system – Temperature measuring system
Reexamination Certificate
2005-04-26
2005-04-26
Barlow, John (Department: 2863)
Data processing: measuring, calibrating, or testing
Measurement system
Temperature measuring system
C702S132000, C702S134000, C702S136000, C700S300000, C374S011000, C374S014000, C374S144000
Reexamination Certificate
active
06885964
ABSTRACT:
In a method and an apparatus for thermal analysis, a target region is divided by dividing the geometry of the target object of the thermal analysis into a finite number of finite elements or cells. The thermal analysis on the target region is conducted using the results of the division. A temperature distribution on the target object is obtained from the heat transfer coefficients by a temperature distribution calculating unit. The actual temperatures at specific points are obtained based on temperature distribution obtained by the specific point temperature calculating unit. Differences between the actually obtained temperatures at the specific points and the predetermined target temperatures at the specific points are obtained by a difference calculating/determining unit. If the differences are determined to be out of the prescribed range, the heat transfer coefficients are changed by a heat transfer coefficient updating unit. These steps are repeated until the differences fall within the prescribed range so that temperature distribution on the target object is obtained. The method and apparatus for thermal analysis obtains temperature distribution universally, irrespective of geometries of the target object.
REFERENCES:
patent: 5202843 (1993-04-01), Kunimine et al.
patent: 5931140 (1999-08-01), Maloney
patent: 5972829 (1999-10-01), Ichimura
patent: 6275750 (2001-08-01), Uchida et al.
patent: 11-118740 (1999-04-01), None
“A Two-Dimensional Finite Difference Program for Thermal Analysis of Rocket Thrust Chambers”, NASA, Huntsfield, US, Sep. 1987, pp. 1-52.
XP-002281446, JP 06 218414 A (Nisshin Steel Co Ltd), Aug. 09, 1994, Derwent Publications Ltd..
Murakami Hirotaka
Ogino Takashi
Barlow John
Birch & Stewart Kolasch & Birch, LLP
Honda Giken Kogyo Kabushiki Kaisha
Vo Hien
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