Method and apparatus for the separation of a first structure...

Cutting – Processes

Reexamination Certificate

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C083S200100

Reexamination Certificate

active

07603932

ABSTRACT:
A method and apparatus is disclosed for the separation of a first structure from a second structure at a connecting point thereof, wherein damage to the first structure is minimized.

REFERENCES:
patent: 596066 (1897-12-01), Helwig
patent: 4890798 (1990-01-01), Tagawa et al.
patent: 5044568 (1991-09-01), Shigemizu
patent: 5058272 (1991-10-01), Steube
patent: 6752054 (2004-06-01), Knight
patent: 6994284 (2006-02-01), Ramun
patent: 7121489 (2006-10-01), Ramun
patent: 2005/0076513 (2005-04-01), Brailovskiy
patent: 19632168 (1997-07-01), None

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