Method and apparatus for the real-time, non-destructive evaluati

Measuring and testing – Moisture content or absorption characteristic of material

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G01N 2900

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040044564

ABSTRACT:
The strength of an adhesion bond can be determined using stress-wave emission techniques. One method measures the stress-wave emitted from the bonding area during the compression phase of the formation of the bond and compares this measurement with a predetermined substantially linear relationship between the emitted stress-wave energy and the strength of the adhesion bond. For more accuracy, a second method measures the stress-wave energy during both the compression phase and a pressure-relief interval, determines the difference between the two measurements, and compares the difference value with the substantially linear relationship. An alternative to the second method subtracts a predetermined threshold value from the pressure-relief interval measurement, reduces the compression phase measurement by the excess determined by said subtraction step, and compares the reduced compression phase measurement with the predetermined substantially linear relationship to determine the strengh of the bond.

REFERENCES:
patent: 3713127 (1973-01-01), Keledy et al.
patent: 3782183 (1974-01-01), O'Connor et al.
patent: 3822586 (1974-07-01), Pollock
Beattie et al., "The Measurement of Energy in Acoustic Emission," in Review of Sci. Instruments, vol. 45, No. 3, Mar. 1974, pp. 352-357.
Jolly, "The Application of Acoustic Emission to In-Process Inspection of Welds," in Materials Evaluation, vol. 28, No. 6, 7/70, pp. 135-139 & 144.
Pollock, "Acoustic Emission Methods of N.D.T.," in British Journal of N.D.T., vol. 13, No. 3, 5/71, pp. 85-89.

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