Method and apparatus for the reactive vapor depositing of metal

Details Method and apparatus for the reactive vapor depositing of metal Method and apparatus for the reactive vapor depositing of metal

1986-09-11

1989-05-09

Nguyen, Nam X.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 42, 427 47, 118723, 118726, 20419231, B05D 306

Patent

active

048288721

ABSTRACT:
A method and apparatus is disclosed for the reactive deposition of vapors of metal compounds onto substrates by the evaporation of at least one metal by means of an electron beam in an atmosphere consisting of the reaction gas, at pressures of no more than 10.sup.-1 mbar. An electrode positively biased with respect to ground and having an acceleration voltage of at least 20 kV is disposed in the area of the vapor stream flowing to the substrate. The metal vapor is produced in an internal chamber which surrounds the evaporator and has a masked orifice opposite the substrate. The reaction gas is introduced into the internal chamber and the metal vapor and reaction gas are guided by the masked orifice toward the substrate.

REFERENCES:
patent: 3454814 (1969-07-01), Mancebo
patent: 3467057 (1969-09-01), Tamura et al.
patent: 3756193 (1973-09-01), Carmichael et al.
patent: 4514437 (1985-04-01), Nath
Bunshah et al., "Activated . . . Compounds", J. Vac. Sci. Technol., vol. 9, No. 6, Nov., Dec. 1972, pp. 1385-1388.

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