Method and apparatus for the production and quality testing...

Measuring and testing – Vibration – By mechanical waves

Reexamination Certificate

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C073S589000, C073S827000

Reexamination Certificate

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06912906

ABSTRACT:
Method of producing a bonded wire connection between an electronic component or a subassembly and a carrier by introducing energy from an ultrasound transducer into a wire that is to be bonded. According to this method, during the introduction of energy the impedance of the ultrasound transducer is measured as a function of time. The shape of the curve representing this time dependence is evaluated on the basis of a pre-specified comparison criteria, and the power input to the ultrasound transducer and/or a bond weight exerted on the wire is/are controlled in dependence on the result of this evaluation. A device usable for carrying out this method is also described.

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patent: 44 47 073 (1996-07-01), None
patent: 2 271 305 (1994-04-01), None

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