Measuring and testing – Vibration – By mechanical waves
Reexamination Certificate
2005-07-05
2005-07-05
Williams, Hezron (Department: 2856)
Measuring and testing
Vibration
By mechanical waves
C073S589000, C073S827000
Reexamination Certificate
active
06912906
ABSTRACT:
Method of producing a bonded wire connection between an electronic component or a subassembly and a carrier by introducing energy from an ultrasound transducer into a wire that is to be bonded. According to this method, during the introduction of energy the impedance of the ultrasound transducer is measured as a function of time. The shape of the curve representing this time dependence is evaluated on the basis of a pre-specified comparison criteria, and the power input to the ultrasound transducer and/or a bond weight exerted on the wire is/are controlled in dependence on the result of this evaluation. A device usable for carrying out this method is also described.
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F&K Delvotec Bondtechnik GmbH
Knobbe Martens Olson & Bear LLP
Saint-Surin Jacques M.
Williams Hezron
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