Metal fusion bonding – Process – Plural joints
Patent
1982-03-23
1985-04-23
Ramsey, Kenneth J.
Metal fusion bonding
Process
Plural joints
228 37, B23K 3102
Patent
active
045125082
ABSTRACT:
Workpieces 11 carrying electronic components 17 are soldered using an automatic soldering machine. In this machine the circuit boards 11 are transported between treatment stations such as a fluxing station I, a drying station II and a soldering station III. The arrangement is such that the circuit boards 11 are separated from the forwarding system 1, 2 at the treatment stations and are either held at rest during treatment or are caused to execute a movement matched to the treatment but independent of the movement of the forwarding system. In this way there is no need to specially tailor the automatic soldering machine to the particular workpiece to be soldered. Instead, a wide variety of different workpieces can be treated efficiently by one and the same soldering machine simply by coding the workpieces and by arranging the machine so that preprogrammed treatments can be carried out in dependence on the coding on the workpieces. The soldering station III is particularly advantageous, it enables a large variety of relative movements to be effected between the solder bath 12 and the workpieces 11. The geometry of the solder bath 12 can also be varied by tilting the solder discharge nozzle 13 which makes the soldering station universally adaptable to different workpieces.
REFERENCES:
patent: 2671264 (1954-03-01), Pessel
patent: 3218193 (1965-11-01), Isaacson
patent: 3421211 (1969-01-01), Eaves et al.
patent: 3499220 (1970-03-01), Hintz et al.
patent: 3500536 (1970-03-01), Goldschmied
patent: 3536243 (1970-10-01), Higgins
patent: 3670698 (1972-06-01), Joosten
patent: 3765591 (1973-10-01), Cook
patent: 3828419 (1974-08-01), Wanner
patent: 4277518 (1981-07-01), Schillke et al.
patent: 4311266 (1982-01-01), Kondo
patent: 4331279 (1982-05-01), Mincher et al.
patent: 4363434 (1982-12-01), Flury
Handbuch der Schweibtechnik, Jurgen Ruge, Springer-Verlag Berlin-HeidelbeNew York 1974, No. 75 12 723.0, Deutsches Patentamt.
Jordan M.
Ramsey Kenneth J.
Zevatron GmbH, Gesellschaft fur Fertigungseinrichtungen der Elek
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