Plastic and nonmetallic article shaping or treating: processes – Vacuum treatment of work – To degas or prevent gas entrapment
Patent
1988-06-29
1989-08-29
Silbaugh, Jan H.
Plastic and nonmetallic article shaping or treating: processes
Vacuum treatment of work
To degas or prevent gas entrapment
264219, 2642972, 2643281, 425138, 425190, 425195, 249 64, 249102, B29C 4526
Patent
active
048615340
ABSTRACT:
A family of circuit boards are molded, each board having its own unique pattern of recessed circuit paths and component insertion through-holes. A different mold is provided for each different member of the family. The two cavity blocks of each mold cavity contain only the holes that are necessary to define the through-hole pattern for that member of the family. A plurality of core pins or wires are provided at the molding site. Only the core pins that are required by the mold in use at the molding site are rendered operative. Features of the method and apparatus, in addition to this core pin insertion feature, include (1) the molding site includes a base member that is usable with all molds of the family, and has means for injecting molding material and means for ejecting a finished circuit board, the injection means and the ejecting means being located in the board's scrap edge area, (2) a hot runner injection system, (3) the mold cavity is placed under a partial vacuum prior to injection, (4) a semiconductor device is selectively used to rapidly heat or cool the mold, and (5) robot means, air and vacuum aids in ejection of a circuit board.
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Boehm Russell W.
Guinn Rex A.
Koerner Hans J.
Heitbrink Jill L.
International Business Machines - Corporation
Silbaugh Jan H.
Sirr Francis A.
Wright Carl M.
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