Method and apparatus for the heat-treatment of a plate-like memb

Details Method and apparatus for the heat-treatment of a plate-like memb Method and apparatus for the heat-treatment of a plate-like memb

1984-02-17

1986-06-03

Leung, Philip H.

Electric heating

Metal heating

Of cylinders

219 1055F, 219 1055A, 219 1067, 148 15, 427 451, 118728, 118 501, H05B 678

Patent

active

045931682

ABSTRACT:
The present invention relates to a method of heat-treating a semiconductor wafer by utilizing an electromagnetic wave. The wafer is floated by the blast of a gas and is held in a non-contacting state, and the electromagnetic wave, such as microwave, is projected on the wafer in this state so as to heat it. According to the present invention, only the wafer is heated and, hence, the wafer can be heat-treated uniformly and efficiently with great precision.

REFERENCES:
patent: 3521018 (1970-07-01), Boerger et al.
patent: 3699298 (1972-10-01), Briody
patent: 4138306 (1979-02-01), Niwa
patent: 4254319 (1981-03-01), Beh et al.
patent: 4456806 (1984-06-01), Arimatsu

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