Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With means applying wave energy or electrical energy...
Patent
1998-06-10
2000-10-24
Ball, Michael W.
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
With means applying wave energy or electrical energy...
156390, 156510, 156584, 156254, 1562728, 156247, 156344, 438 62, 438484, 2191216, 21912165, 21912167, B32B 3128, B23K 2600
Patent
active
061361410
ABSTRACT:
Lightweight semiconductor devices are fabricated upon a relatively thin substrate member by a process wherein the substrate is first bonded to a relatively thick support member. The semiconductor device is then formed on the bonded substrate, and the substrate is subsequently removed from the support member by utilizing a beam of radiant energy to skive the substrate from the support member without damage to the semiconductor device. Also disclosed herein is a system for implementing the invention.
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patent: 4185185 (1980-01-01), Adlam
patent: 4328410 (1982-05-01), Slivinsky et al.
patent: 4341588 (1982-07-01), Sterling
patent: 4379020 (1983-04-01), Glaeser et al.
patent: 4663829 (1987-05-01), Hartman et al.
patent: 5378639 (1995-01-01), Sasaki et al.
Akkashian Eric
Glatfelter Troy
Lycette Mark
Ball Michael W.
Sky Solar L.L.C.
Tolin Michael A
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