Method and apparatus for the excise and lead form of TAB devices

Metal working – Method of mechanical manufacture – Electrical device making

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Details

295662, 295663, 72427, 72428, 140105, 140147, H01R 4300, B23P 2300

Patent

active

052109364

ABSTRACT:
The excise and lead form of TAB leads bonded to an integrated circuit chip. Leads extending beyond a sidewall are clamped between a first clamp and a form anvil at a first portion spaced from the chip. The leads are also clamped between an excise/form tool and a second clamp at a second portion spaced further from the chip than the first portion. An excise blade cuts the leads outside the second portion. Then the excise/form tool, second clamp and excise blade move downwards in a curved path toward the chip to form a first lead corner against the form anvil and a second lead corner against the excise/form tool without splaying or galling the leads.

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"Comparative Compliance of Generic Lead Designs for Surface Mounted Components" by Robert T. Kotlowitz, AT&T Bell Laboratories, Whippany, N.J. 07981, pp. 7-19.

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