Method and apparatus for the continuous on-site chemical reproce

Chemistry: electrical and wave energy – Processes and products – Electrostatic field or electrical discharge

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204 82, 204104, 156642, 423531, 134 12, 134 13, 134 21, 134 254, 134109, C25F 500

Patent

active

048550230

ABSTRACT:
An improved wafer cleaning process wherein a novel oxidant solution comprising ultrapure sulfuric acid, peroxydisulfuric acid, and ultrapure water used in a semiconductor wafer cleaning process is continuously withdrawn after use. The withdrawn oxidant is reprocessed continuously by contacting with alumina to remove fluoride ions. Water is continuously separated or stripped from the oxidant solution by heating the solution and bubbling an inert gas therethrough. The separated oxidant is continuously distilled and condensed to form a purified stream of sulfuric acid. The major portion of this stream is continuously returned to the wafer cleaning process. The remaining minor portion is continuously cooled, subjected to analysis for purity, and diluted with ultrapure water prior to electrochemical treatment in the anode compartment of an electrochemical cell. This converts at least a portion of the dilute sulfuric acid to peroxydisulfuric acid. The resulting solution is continuously returned to the wafer cleaning process to be mixed with the major portion of the purified sulfuric acid.

REFERENCES:
patent: 3677701 (1972-07-01), Hellingsworth et al.
patent: 3728154 (1973-04-01), Suzuki
patent: 4085016 (1978-04-01), Janjua et al.
patent: 4329155 (1982-05-01), Schlegel
patent: 4397719 (1983-08-01), Yoshida

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