Method and apparatus for the bonding of a contact element

Electric heating – Metal heating – By arc

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Details

21912183, 21912185, 385 91, B23K 2602

Patent

active

059389516

DESCRIPTION:

BRIEF SUMMARY
The present invention relates to a method and an apparatus for the bonding of a contact element on a substrate.
An apparatus and a method for the production of a laser diode arrangement is known from EP-A-356988, in which the exact relative positioning between one end of an optical fibre and a laser diode takes place in the molten state of connection solder as a function of a peak of the radiation energy transmitted from the laser diode into the optical fibre. Devices which are independent from one another, namely a positioning manipulator and a soldering piston are used for positioning and connection by the known method.


BACKGROUND OF THE INVENTION

The object of the present invention is to provide a method and an apparatus of the type mentioned at the outset which simplify the bonding of a contact element on a substrate.
This object is achieved by a method and an apparatus having the features of the invention.


SUMMARY OF THE INVENTION

With the method according to the invention, the contact element is held by a connecting device which is designed as a bonding head and is at the same time used for the positioning and energy loading of the contact element.
To enable the supply of energy or the interruption thereof to be controlled particularly exactly, energy loading by a laser source has proven particularly advantageous as the laser energy can be introduced into the connecting region at a precisely defined point by means of an optical fibre arrangement, and the introduction of energy by energy radiation allows substantially delay-free shut off without a buffer effect, as is the case, for example, with thermal conduction.
It is particularly advantageous if the method according to the invention is applied during the coupling of an optical fibre to an element which emits laser energy, for example, a laser diode, the laser energy outlet surface of the element arranged on the substrate serving as emmission surface and the contact element being provided by the optical fibre. Application of the method according to the invention allows substantially loss-free coupling of the optical fibre to the laser diode. The laser energy which is emitted from the laser energy outlet surface of the laser diode and is introduced into the optical fibre provided for coupling to the laser diodes is used as reference energy. The reference energy issuing from the optical fibre can be measured to determine the optimum relative position, the optimum relative position being obtained when the issuing energy reaches its peak. Therefore, the application of the method in the production of a diode laser arrangement with optical fibre coupling allows efficiency of the diode laser arrangement barely attainable hitherto.
To allow simple pre-adjustment of the contact element, which corresponds to the optical fibre when applying the method to the production of a diode laser arrangement, relative to the emission surface on the substrate, the contact element cross section can be received at least partially in a positioning device. This positioning device determines the limits within which relative positioning of the contact element with respect to the emission surface is possible and therefore avoids an excessively large positional deviation between the contact element and the emission surface which would unnecessarily lengthen the duration of implementation of the method.
In the case of a metallic design of the outer periphery of the contact element, that is the optical fibre cladding, the positioning device can have at least two contact metallization mounds known as so-called bumps. This type of positioning device has the advantage that the positioning device itself provides the connecting material required for the thermal connection between the contact element and the substrate.
In particular when the method is used for the bonding of a contact element designed as a wire conductor, it may prove advantageous to superimpose ultrasonic energy on the thermal energy for the energy loading of the contact element.
The features of the invention rel

REFERENCES:
patent: 3463898 (1969-08-01), Takaoka et al.
patent: 4357072 (1982-11-01), Goodfellow et al.
patent: 4854667 (1989-08-01), Ebata et al.
patent: 4946246 (1990-08-01), Shiga
patent: 4970365 (1990-11-01), Chalco
patent: 5178723 (1993-01-01), Nguyen
patent: 5421506 (1995-06-01), Kooijman et al.
PCT International Search Report PCT/DE94/00677, Jun. 16, 1994.

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