Method and apparatus for the assembly of semiconductor devices

Details Method and apparatus for the assembly of semiconductor devices Method and apparatus for the assembly of semiconductor devices

1974-07-12

1976-06-08

Tupman, W.

Metal working

Plural diverse manufacturing apparatus including means for...

Common reciprocating support for spaced tools

228 51, 228 6A, B01J 1700

Patent

active

039614131

ABSTRACT:
A dual-in-line plastic package for an integrated circuit is assembled with the use of a thermal stress-resistant thin-film interconnect pattern on a flexible insulator film. All electrical connections to the semiconductor chip are made simultaneously by bonding directly to the thin-film interconnect pattern. Each segment of the interconnect pattern is then connected simultaneously to a simplified external lead frame, by means of a novel soldering technique. The assembly is then ready for plastic encapsulation and final trimming. By supplying both the flexible interconnect pattern and the external lead frame in continuous coils or reels, a high degree of handling simplicity, speed and accuracy is achieved with a maximum opportunity for automation, to produce a low work content product.

REFERENCES:
patent: 3689991 (1972-09-01), Aird
patent: 3777365 (1973-12-01), Umbaugh
patent: 3793714 (1974-02-01), Bylander

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