Method and apparatus for the assembly of microfabricated devices

Metal working – Method of mechanical manufacture – Electrical device making

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29832, 29729, 29744, 29DIG46, H01S 400, B23P 1900

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active

053555775

ABSTRACT:
Abstract: A method of rapidly assembling many discrete microelectronic or micro-mechanical devices 56 (FIG. 2 ) in a precise configuration (FIG. 8f). The devices are placed randomly on a template (FIG. 3 ) consisting of a pair of oppositely charged planar electrodes. The upper electrode contains a multiplicity of apertures. The template is vibrated and the devices are attracted to the apertures and trapped thereat. The shape of a given aperture determines the number, orientation, and type of device that it traps. The process is completed by mechanically and electrically connecting the devices. The present method for serf-assembly allows many sub-millimeter sized electronic components or other particles to be rapidly assembled into a predetermined configuration. The method relies on vibration and weak electrical or magnetic forces.

REFERENCES:
patent: 3439416 (1969-04-01), Yando
patent: 3812569 (1974-05-01), Kufner et al.
patent: 4111294 (1978-09-01), Carpenter et al.
patent: 4194668 (1980-03-01), Akyurek
patent: 4542397 (1985-09-01), Biegelson
patent: 4554611 (1985-11-01), Lewin
patent: 4802951 (1989-02-01), Clark et al.
patent: 4843035 (1989-06-01), Takashima
patent: 4907062 (1990-03-01), Fukushima
patent: 4962441 (1990-10-01), Collins
patent: 5034802 (1991-07-01), Liebes
patent: 5075253 (1991-12-01), Sliwa
Huang, Y. and R. Pethig, "Electrode Design for Negative Dielectrophoresis," Measurement Science and Technology 2(1991) 1142-1146.
Cohn, M. B., "Self-Assembling Electrical Networks . . ." Proceedings of 1991 Int'l Conf. on Solid-State Sensors & Actuators, San Francisco, Jun. 1991.

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