Method and apparatus for the assembly of jacketed electronic dev

Details Method and apparatus for the assembly of jacketed electronic dev Method and apparatus for the assembly of jacketed electronic dev

1976-08-05

1978-02-21

Duzan, James R.

Metal working

Method of mechanical manufacture

Electrical device making

29590, 29748, 29759, 29760, 228123, 228135, 228 6A, H01R 4302

Patent

active

040744205

ABSTRACT:
An apparatus and method employing a plurality of heating boats to provide for the soldered assembly of leads, electronic components and plastic jackets without intermediate handling steps. Two heating boats are positioned on either side of a jacket retaining block such that the heating cavities of the first boat are aligned in an opposed relationship with the heating cavities of the second boat. Passageways through the plate extend between the opposed heating cavities. The heating cavities of the first boat receive leads, electronic components and solder wafers which are heated to form assembled electronic devices. The assembled devices are then moved through the passageways in the plate into the second boat where jackets, previously positioned in the heating cavities of the second boat, are heated to recover about the leads and components. The leads are maintained in alignment in passageways extending from the closed ends of the heating cavities to prevent premature bending loads on the assembled components.

REFERENCES:
patent: 3178796 (1965-04-01), Smits
patent: 3299502 (1967-01-01), Wanesky
patent: 3414962 (1968-12-01), Altamura
patent: 3446912 (1969-05-01), Diehl et al.
patent: 3800408 (1974-04-01), Schimmer et al.

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