Method and apparatus for the analysis of scratches on...

Details Method and apparatus for the analysis of scratches on... Method and apparatus for the analysis of scratches on...

2005-09-13

2005-09-13

Bui, Bryan (Department: 2863)

Data processing: measuring, calibrating, or testing

Measurement system

Performance or efficiency evaluation

C702S182000

Reexamination Certificate

active

06944573

ABSTRACT:
For the analysis of scratches on semiconductor wafers, the semiconductor wafer surface is detected and a possible scratch position or a scratch course on the semiconductor surface is determined, in which case a parameter value identifying the scratch is determined from the scratch position and the scratch course and this parameter value that has been determined is correlated with comparison parameter values, which identify installation-specific scratch positions and scratch courses, in order to determine an installation causing the scratch.

REFERENCES:
patent: 5913105 (1999-06-01), McIntyre et al.
patent: 6407373 (2002-06-01), Dotan
patent: 6493645 (2002-12-01), Hladschik
patent: 2004/0036863 (2004-02-01), Matsusita et al.

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