Method and apparatus for testing the clamp of a solderless elect

Details Method and apparatus for testing the clamp of a solderless elect Method and apparatus for testing the clamp of a solderless elect

1980-01-08

1981-11-10

Ruehl, Charles A.

Measuring and testing

Specimen stress or strain, or testing by stress or strain...

By loading of specimen

73856, 73852, G01N 320

Patent

active

042991315

ABSTRACT:
An apparatus and method for testing the mechanical strength of a solderless electrical connection having a clamp deformable to retain a bundle of wires against a pin has a double-T-shaped cross piece over which a clamp to be tested is slided. The cross piece has a vertical bore therein for receiving a pressure-applying die for subjecting the clamp to a test pressure. The die is actuated by a motor-driven spindle and a transducer transforms the applied pressure to a voltage for display. Pressure is applied following a pre-determined curve corresponding to worst cast configurations of a wire bundle which may result in failure of the clamp to securely retain the bundle.

REFERENCES:
patent: 2702473 (1955-02-01), Dames et al.
patent: 4167112 (1979-09-01), Ressler
Brochure Entitled "Clamp Connection Termi Point Wiring Technique", Siemens (SFR F12-F145), Nov. 1976.

Affiliated with

Also associated with

Rating

Method and apparatus for testing the clamp of a solderless elect does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for testing the clamp of a solderless elect, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for testing the clamp of a solderless elect will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2357649