Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate
2007-09-18
2007-09-18
Nguyen, Ha Tran (Department: 2829)
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
Reexamination Certificate
active
11037870
ABSTRACT:
The present invention provides a method for testing semiconductor wafers by means of a temperature-regulated chuck device, comprising the following steps: controlling the temperature of the chuck device to a predetermined measurement temperature by means of a heating device having a predefined heating power and a cooling device having a predefined cooling capacity, the heating power being substantially greater than a predefined testing power; laying the rear side of a semiconductor wafer on a supporting side of the temperature-regulated chuck device; placing a probe card on the front side of the semiconductor wafer; testing the semiconductor wafer by impressing the testing power from a testing apparatus into a chip region of the front side of the semiconductor wafer by means of probes of the probe card placed on; reducing the heating power by the amount of the testing power during the testing with a substantially constant cooling capacity. The invention also provides a corresponding apparatus.
REFERENCES:
patent: 4791364 (1988-12-01), Kufis et al.
patent: 4845426 (1989-07-01), Nolan et al.
patent: 5084671 (1992-01-01), Miyata et al.
patent: 5124639 (1992-06-01), Carlin et al.
patent: 5166607 (1992-11-01), Long
patent: 5775416 (1998-07-01), Heimanson et al.
patent: 5977785 (1999-11-01), Burward-Hoy
patent: 6111421 (2000-08-01), Takahashi et al.
patent: 6366105 (2002-04-01), Chiang
patent: 6552561 (2003-04-01), Olsen et al.
patent: 2002/0011856 (2002-01-01), Huang et al.
patent: 2002/0017916 (2002-02-01), Costello et al.
patent: 2002/0062954 (2002-05-01), Getchel et al.
patent: 2002/0186031 (2002-12-01), Pelissier
patent: 2004/0036492 (2004-02-01), Gaasch et al.
patent: 3536098 (1987-04-01), None
patent: 19983379 (2001-09-01), None
patent: 0106273 (2001-01-01), None
patent: 03027686 (2003-04-01), None
PCT International Search Report for PCT/EP2006/000142 for corresponding PCT Application dated Apr. 19, 2006.
Johnston Michael G.
Moore & Van Allen PLLC
Nguyen Ha Tran
Nguyen Tung X.
Skord Jennifer L.
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