Method and apparatus for testing RF modules

Details Method and apparatus for testing RF modules Method and apparatus for testing RF modules

2005-09-13

2005-09-13

Nguyen, Hoang V. (Department: 2821)

Communications: radio wave antennas

Antennas

With radio cabinet

C343S703000

Reexamination Certificate

active

06943739

ABSTRACT:
A device that has an antenna and an internal RF circuit is connected by an electrical conductor that has a first portion coupled to the RF circuit and an opposed, flexibly resilient second portion. The second portion defines a contact point and a testing point. The contact point is normally electrically coupled to the antenna by a bias in the second portion. When a biasing force such as a RF testing probe exerts force on the testing point through an aperture of a device housing, the normal bias of the second portion is overcome and contact is temporarily interrupted between the antenna and the contact point. The RF probe is placed in electrical contact with the RF circuit by contact with the testing point, which may be directly when a cover over the aperture is removable, or via a conductive pathway imposed through a flexible membrane that is fixed to the housing as a cover over the aperture.

REFERENCES:
patent: 5832372 (1998-11-01), Clelland et al.
patent: 6271465 (2001-08-01), Lacey
patent: 6459287 (2002-10-01), Nightingale et al.
patent: 6469673 (2002-10-01), Kaiponen
patent: 6486835 (2002-11-01), Wakeham
patent: 2001/0023176 (2001-09-01), Talvitie et al.
patent: 2002/0000946 (2002-01-01), Portin
patent: 2004/0175978 (2004-09-01), Mugiuda et al.

Affiliated with

Also associated with

Rating

Method and apparatus for testing RF modules does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for testing RF modules, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for testing RF modules will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3426367