Method and apparatus for testing of integrated circuit package

Details Method and apparatus for testing of integrated circuit package Method and apparatus for testing of integrated circuit package

2005-10-11

2005-10-11

Nguyen, Vinh (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

Reexamination Certificate

active

06954082

ABSTRACT:
A method and apparatus for testing an integrated circuit (IC) package includes a printed circuit board (PCB) on which is mounted the IC package and which is removably connected (preferably perpendicular) to a motherboard. The IC package, the PCB and the motherboard are subjected to thermal, humidity and/or electrical test conditions.

REFERENCES:
patent: 5742168 (1998-04-01), Kiyokawa et al.
patent: 6287878 (2001-09-01), Maeng et al.
patent: 6597189 (2003-07-01), Grilletto
patent: 6750646 (2004-06-01), Voss et al.
IPC-9701, “Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments,” IPC—Association Connecting Electronics Industries, cover page.

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