Measuring and testing – Specimen stress or strain – or testing by stress or strain... – By loading of specimen
Patent
1997-11-18
1999-10-19
Noori, Max
Measuring and testing
Specimen stress or strain, or testing by stress or strain...
By loading of specimen
73831, G01N 308
Patent
active
059692626
ABSTRACT:
A probe made of copper and supported by a movable arm via a load cell and a jig has a joining surface having good wettability with solder at the tip end thereof and has a covering portion having poor wettability with the solder around the circumferential periphery. The solder and flux are stuck to the joining surface and the solder is put into contact with a bump electrode to be tested on a substrate in this state. Then, the solder is melted by an induction heating coil and then cooled down and solidified to join the bump electrode to be tested to the probe. The bump electrode is broken by pulling up the probe in this state at a constant speed and at the same time the pulling force exerted on the probe is measured by the load cell.
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Ino Koji
Watanabe Yusuke
Denso Corporation
Noori Max
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