Method and apparatus for testing integrated circuit chips

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

324757, G01R 1073

Patent

active

056592566

ABSTRACT:
A method and apparatus for testing semi-conductor chips is disclosed. The individual semiconductor chips have I/O contacts. The apparatus is provided with an interposer that has contacts corresponding to the contacts on the semiconductor chip. Both the chip and the interposer contacts can be any known type including metal ball, bumps, or tabs or may be provided with dendritic surfaces. The chip contacts are first brought into relative loose temporary contact with the contacts on the interposer and then a compressive force greater that 5 grams per chip contact is applied to the chip to force the chip contacts into good electrical contact with the interposer contacts. Testing of the chip is then performed. The tests may include heating of the chip as well as the application of signals to the chip contacts. After testing the chip is removed from the substrate.

REFERENCES:
patent: 5367253 (1994-11-01), Wood et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method and apparatus for testing integrated circuit chips does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for testing integrated circuit chips, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for testing integrated circuit chips will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1107496

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.