Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Patent
1997-12-18
2000-10-31
Karlsen, Ernest
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
324158, G01R 3102
Patent
active
061408271
ABSTRACT:
A method and apparatus for testing unpackaged semiconductor dice having raised contact locations is disclosed. The apparatus uses a temporary interconnect wafer that is adapted to establish an electrical connection with the raised ball contact locations on the die without damage to the contact location. The interconnect is fabricated on a substrate, such as silicon, where contact members are formed in a pattern that matches the size and spacing of the contact locations on the die to be tested. The contact members on the interconnect wafer are formed as either pits, troughs, or spike contacts. The spike contacts penetrate through the oxide layer formed on the raised ball contact locations contact pad. Conductive traces are provided in both rows and columns and are terminated on the inner edges of the walls of the pits formed in the substrate. This arrangement allows a system to measure the continuity across the bump pad or ball contact locations of the integrated circuit die in order to establish that each solder ball location is properly attached. This allows the system to test for the presence and quality of the bumps or balls on the particular die being tested.
REFERENCES:
patent: 229757 (1880-07-01), Ross
patent: 4792683 (1988-12-01), Chang et al.
patent: 4838800 (1989-06-01), Lynch
patent: 5058178 (1991-10-01), Ray
patent: 5089772 (1992-02-01), Hatada et al.
patent: 5108024 (1992-04-01), Kazen-Goudarzi et al.
patent: 5225037 (1993-07-01), Elder et al.
patent: 5479105 (1995-12-01), Kim et al.
patent: 5479694 (1996-01-01), Baldwin
patent: 5510721 (1996-04-01), Walles et al.
patent: 5523696 (1996-06-01), Charlton et al.
patent: 5530375 (1996-06-01), Seidel
patent: 5543724 (1996-08-01), Christopher
patent: 5550763 (1996-08-01), Michael et al.
patent: 5585281 (1996-12-01), Truhitte et al.
patent: 5617209 (1997-04-01), Svettkoff et al.
WYKO, 2650 East Elvira Road, Tucson, Arizona USA 85706--Advertisement--single page, "Now see all the bumps on the road to success in flip-chip packaging", prior to Dec. 1997.
Karlsen Ernest
Micro)n Technology, Inc.
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