Method and apparatus for testing an integrated circuit

Details Method and apparatus for testing an integrated circuit Method and apparatus for testing an integrated circuit

1996-10-23

1997-09-09

Karlsen, Ernest F.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

29885, 430313, G01R 3100, G01R 106, H01R 4300

Patent

active

056660634

ABSTRACT:
An apparatus and method for laser ablating residue off of probe tips. In one embodiment, the probe tips of the probe needles (16) contact the test pads of an integrated circuit on a wafer (18). The probe tips build up a residue over time. This residue is due to the probe tips coming into contact with integrated circuit wafer layers such as layers (114), (120), (122), (124), and (126). This residue can be vaporized from the surface of the probe needles via exposure to a laser light. The probe needles (16) are exposed to a laser light created by a laser source (28) and ported to the probe tips by a fiber optic cable (26).

REFERENCES:
patent: 5172473 (1992-12-01), Burns et al.

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