Package making – Methods – Closing package or filled receptacle
Reexamination Certificate
2002-10-29
2004-11-23
Huynh, Louis (Department: 3721)
Package making
Methods
Closing package or filled receptacle
C053S478000, C053S487000, C053S282000, C053S289000, C053S290000
Reexamination Certificate
active
06820401
ABSTRACT:
FIELD OF THE INVENTION
This invention relates to an apparatus for packaging parts, which may be, for example, microprocessors, computer chips, circuit boards, or any other electrical or mechanical components, in the compartments of a carrier tape, and affixing a cover tape over the carrier tape to trap the parts in the compartments. More specifically, the invention relates to a method for pulling tight or tensioning the cover tape after it has been sealed to the carrier tape.
BACKGROUND OF THE INVENTION
Small parts, such as microprocessors, computer chips, circuit boards, or any other electrical or mechanical components are often packaged in carrier tape holding compartments. These compartments are then sealed with cover tape to ensure that the parts will not fall out of the compartments. During the cover tape sealing process, the cover tape may buckle or bow, which compromises the peel strength of the cover tape. Additionally, ripples or creases in the cover tape caused by such buckling or bowing may be mistaken during post-seal inspection as a “sealing perimeter” or “part” defect, which can result in a rejection of a good part due to poor packaging.
SUMMARY OF THE INVENTION
The invention provides a method for attaching cover tape to carrier tape having side flanges and compartments between the side flanges. The method includes bending at least one of the side flanges of the carrier tape upward as the cover tape is bonded to both side flanges, and then releasing the bent flange once the cover tape is bonded to the flanges. The released flange returns to a flat orientation, which creates a tension in the cover tape, and ensures a tight fit of the cover tape over the compartments of the carrier tape.
REFERENCES:
patent: 3116580 (1964-01-01), Anderson
patent: 3780493 (1973-12-01), Baker
patent: 4969306 (1990-11-01), Wallin
patent: 5597428 (1997-01-01), Matsumoto et al.
patent: 5729963 (1998-03-01), Bird
patent: 5846621 (1998-12-01), Nagamatsu
patent: 6250051 (2001-06-01), Mori et al.
patent: 6404181 (2002-06-01), Hikita
patent: 6425484 (2002-07-01), Sakurai
patent: WO 99/03733 (1999-01-01), None
Huynh Louis
International Product Technology, Inc.
Michael & Best & Friedrich LLP
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