Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate
2007-08-21
2007-08-21
Patel, Paresh (Department: 2829)
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
C324S1540PB
Reexamination Certificate
active
10906483
ABSTRACT:
A method, system and apparatus for testing an electronic device. The method including: (a) forming a temporary liquid heat transfer layer on a surface of the electronic device; after step (a), (b) placing a surface of a heat sink into physical contact with a surface of the heat transfer layer; after step (b), (c) electrically testing the electronic device; after step (c), (d) removing the heat sink from contact with the heat transfer layer; and after step (d), (e) removing any heat transfer layer remaining on the electronic device from the surface of the electronic device.
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“Hign Conduction Thermal Interface Material” by IBM Technical Disclosure Bulletin, Oct. 1993, US pp. 581-583 (three pages).
Aube Paul J.
Cote Normand
Gamache, Jr. Roger G.
Gardell David L.
Gaschke Paul M.
Canale Anthony J.
International Business Machines - Corporation
Patel Paresh
Schmeiser Olsen & Watts
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