Thermal measuring and testing – Temperature measurement – Composite temperature-related paramenter
Reexamination Certificate
2005-10-07
2008-11-25
Verbitsky, Gail (Department: 2831)
Thermal measuring and testing
Temperature measurement
Composite temperature-related paramenter
C702S130000, C702S099000, C331S057000
Reexamination Certificate
active
07455450
ABSTRACT:
A method and apparatus for temperature sensing in an IC. The IC includes a plurality of remote temperature sensors each coupled to a control logic unit. The plurality of remote temperature sensors may be distributed throughout the integrated circuit. The integrated circuit includes a reference unit coupled to provide a reference temperature to the control logic unit and a reference sensor coupled to provide a signal having a reference frequency to the control logic unit. The reference unit and the reference sensor are located near each other. The control logic unit is configured to correlate the reference frequency received from the reference sensor with the reference temperature received from the reference unit. The control logic unit is further configured to determine the temperature of each of the remote temperature sensors based on this correlation, and also configured to determine the maximum temperature of all of the temperature sensors.
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Hewitt Larry D.
Liu Huining
Advanced Micro Devices , Inc.
Heter Erik A.
Meyertons Hood Kivlin Kowert & Goetzel P.C.
Vaughn Megann E
Verbitsky Gail
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