Method and apparatus for temperature compensated optical sensor

Radiant energy – Photocells; circuits and apparatus – Optical or pre-photocell system

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250548, H01J 314

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active

057509786

ABSTRACT:
A method and apparatus for mounting an optical sensor in an optical instrument. The optical sensor is attached to a rigid substrate. The substrate has two locator holes, with the sensor mounted between the holes. Rigid locator pins attached to the housing of the instrument protrude into the locator holes. A spring pushing against the substrate forces the locator holes against corresponding locator pins, aligning the substrate within a plane. In a first embodiment, the holes are positioned so that the optical sensor is rigidly held at its midpoint, minimizing dimensional deviations along the length of the sensor with temperature change. The sensor assembly is easily removable and the mounting apparatus does not mechanically stress the substrate or the sensor with temperature changes. The mounting apparatus is easily manufactured, allows precise alignment, and is inexpensive.

REFERENCES:
patent: 4972079 (1990-11-01), Blanding
patent: 5111041 (1992-05-01), Imai
patent: 5115125 (1992-05-01), Biggs
Patent Abstracts of Japan vol. 16, No. 354 (E-1242) 30 Jul. 1992 & JP-A-04 111 686 (Canon Inc) 13 Apr. 1992 *abstract*.
Database WPI Derwent Publications Ltd., London, GB; AN 91-211213 & JP-A-3 132 934 (Konica Corp) 6Jun. 1991 *abstract*.
Patent Abstracts of Japan vol. 13, No. 235 (E-766) 30 May 1989 & JP-A-01 041 383 (Canon Inc) 13 Feb. 1989 *abstract*.
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