Method and apparatus for synthesizing high-frequency signals...

Details Method and apparatus for synthesizing high-frequency signals... Method and apparatus for synthesizing high-frequency signals...

2007-04-24

2007-04-24

Kinkead, Arnold (Department: 2817)

Oscillators

Automatic frequency stabilization using a phase or frequency...

Particular frequency control means

C331S10800D, C257S531000, C438S238000

Reexamination Certificate

active

11146337

ABSTRACT:
A semiconductor package includes a package substrate and an integrated circuit. The package substrate has a first surface. The integrated circuit couples electrically to the first surface of the package substrate. The integrated circuit and the package substrate together form the semiconductor package. The semiconductor package also includes a first inductance circuit and a second inductance circuit, both formed within the semiconductor package. The first and second inductance circuits couple to each other in parallel. The first and second inductance circuits have substantially symmetrical geometric characteristics.

REFERENCES:
patent: 6323735 (2001-11-01), Welland et al.

Affiliated with

Also associated with

Rating

Method and apparatus for synthesizing high-frequency signals... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for synthesizing high-frequency signals..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for synthesizing high-frequency signals... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3794991