Oscillators – Relaxation oscillators – Involving resonant or inductive wave forming circuit or...
Reexamination Certificate
2005-06-07
2005-06-07
Lam, Tuan T. (Department: 2816)
Oscillators
Relaxation oscillators
Involving resonant or inductive wave forming circuit or...
C331S015000, C331S018000
Reexamination Certificate
active
06903617
ABSTRACT:
A semiconductor package includes a package substrate and an integrated circuit. The package substrate has a first surface. The integrated circuit couples electrically to the first surface of the package substrate. The integrated circuit and the package substrate together form the semiconductor package. The semiconductor package also includes a first inductance circuit and a second inductance circuit, both formed within the semiconductor package. The first and second inductance circuits couple to each other in parallel. The first and second inductance circuits have substantially symmetrical geometric characteristics.
REFERENCES:
patent: 4070632 (1978-01-01), Tuttle
patent: 4107728 (1978-08-01), Max
patent: 4193083 (1980-03-01), Max
patent: 4236252 (1980-11-01), Kominami et al.
patent: 4468790 (1984-08-01), Hofelt
patent: 4562591 (1985-12-01), Stikvoort
patent: 4584659 (1986-04-01), Stikvoort
patent: 4604720 (1986-08-01), Stikvoort
patent: 4623926 (1986-11-01), Sakamoto
patent: 4627021 (1986-12-01), Persoon et al.
patent: 4680588 (1987-07-01), Cantwell
patent: 4692737 (1987-09-01), Stikvoort et al.
patent: 4713563 (1987-12-01), Marshall et al.
patent: 4797845 (1989-01-01), Stikvoort
patent: 4857928 (1989-08-01), Gailus et al.
patent: 4912729 (1990-03-01), Van Rens et al.
patent: 4989074 (1991-01-01), Matsumoto
patent: 4998077 (1991-03-01), Nanni et al.
patent: 5050192 (1991-09-01), Nawata
patent: 5083304 (1992-01-01), Cahill
patent: 5124705 (1992-06-01), Voorman
patent: 5142695 (1992-08-01), Roberts et al.
patent: 5148266 (1992-09-01), Khandros et al.
patent: 5157343 (1992-10-01), Voorman
patent: 5194826 (1993-03-01), Huusko
patent: 5235410 (1993-08-01), Hurley
patent: 5241310 (1993-08-01), Tiemann
patent: 5243345 (1993-09-01), Naus et al.
patent: 5258330 (1993-11-01), Khandros et al.
patent: 5267272 (1993-11-01), Cai et al.
patent: 5283578 (1994-02-01), Ribner et al.
patent: 5341135 (1994-08-01), Pearce
patent: 5345406 (1994-09-01), Williams
patent: 5347159 (1994-09-01), Khandros et al.
patent: 5428245 (1995-06-01), Lin et al.
patent: 5430890 (1995-07-01), Vogt et al.
patent: 5442353 (1995-08-01), Jackson
patent: 5451948 (1995-09-01), Jekel
patent: 5469475 (1995-11-01), Voorman
patent: 5500645 (1996-03-01), Ribner et al.
patent: 5557642 (1996-09-01), Williams
patent: 5659952 (1997-08-01), Kovac et al.
patent: 5698469 (1997-12-01), Mohwindel et al.
patent: 5712628 (1998-01-01), Phillips et al.
patent: 5740524 (1998-04-01), Pace et al.
patent: 5742189 (1998-04-01), Yoshida et al.
patent: 5758276 (1998-05-01), Shirakawa et al.
patent: 5764171 (1998-06-01), Stikvoort
patent: 5790005 (1998-08-01), Santi et al.
patent: 5821608 (1998-10-01), DiStefano et al.
patent: 5828955 (1998-10-01), Lipowski et al.
patent: 5852384 (1998-12-01), Sakakura et al.
patent: 5859878 (1999-01-01), Phillips et al.
patent: 5862465 (1999-01-01), Ou
patent: 5866949 (1999-02-01), Schueller
patent: 5867069 (1999-02-01), Kiser
patent: 5886393 (1999-03-01), Merrill et al.
patent: 5920235 (1999-07-01), Beards et al.
patent: 5973601 (1999-10-01), Campana
patent: 6002925 (1999-12-01), Vu et al.
patent: 6035186 (2000-03-01), Moore et al.
patent: 6044548 (2000-04-01), Distefano et al.
patent: 6060951 (2000-05-01), Inoue
patent: 6075979 (2000-06-01), Holtvoeth et al.
patent: 6137372 (2000-10-01), Welland
patent: 6148048 (2000-11-01), Kerth et al.
patent: 6150891 (2000-11-01), Welland et al.
patent: 6167245 (2000-12-01), Welland
patent: 6310386 (2001-10-01), Shenoy
patent: 6323735 (2001-11-01), Welland et al.
patent: 6343207 (2002-01-01), Hessel et al.
patent: 6424223 (2002-07-01), Wang et al.
patent: 6452247 (2002-09-01), Gardner
patent: 6495912 (2002-12-01), Huang et al.
patent: 6512422 (2003-01-01), Dufour et al.
patent: 6539066 (2003-03-01), Heinen
patent: 6576998 (2003-06-01), Hoffman
patent: 6608367 (2003-08-01), Gibson et al.
patent: 6617943 (2003-09-01), Fazelpour
Cong et al., “Multigigahertz CMOS Dual-Modulus Prescalar IC”, IEEE Journal Of Solid-State Circuits, vol. 23, No. 5, Oct. 1988, pps. 1189-1194.
Duncan et al., “A 1 GHz Quadrature Sinusoidal Osciallator”, IEEE Custom Integrated Circuits Conference, 1995, pps. 91-94.
Craninckx et al., “A 1.8-GHz CMOS Low-Phase-Noise Voltage-Controlled Oscillator With Prescaler”, IEEE Journal of Solid-State Circuits, vol. 30, No. 12, Dec. 1995, pps. 1474-1482.
Chang et al., “A 1.2 GHz CMOS Dual-Modulus Prescaler Using New Dynamic D-Type Flip-Flops”, IEEE Journal of Solid-State Circuits, vol. 31, No. 5, May 1996, pps. 749-752.
Craninckx et al. “A 1.75-GHz/3-V Dual-Modulus Divide-by-128/129 Prescaler In 0.7-μm CMOS”, IEEE Journal of Solid-State Circuits, vol. 31, No. 7, Jul. 1996, pps. 890-897.
Kral et al., “RF-CMOS Osciallators With Switched Tuning”, Custom IC Conference, Santa Clara, CA, May 1998, pps. 555-558.
Silicon Laboratories, “Dual-Band RF Frequency Synthesizer With Integrated VCOs For Wireless Communications”, SI 4133, 1999, pps. 1-28.
Craninckx, “Low-Phase-Noise Fully Integrated CMOS Frequency Synthesizers”, Dec. 1997, pps. 77-104.
Healy Edmund G.
Lim Lysander
Pavelka John B.
Welland David R.
Lam Tuan T.
Nguyen Hiep
O'Keefe Egan & Peterman, LLP
Silicon Laboratories Inc.
LandOfFree
Method and apparatus for synthesizing high-frequency signals... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for synthesizing high-frequency signals..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for synthesizing high-frequency signals... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3520264