Method and apparatus for surfacing a board-like object

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With bending – folding – winding – or wrapping means

Reexamination Certificate

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Details

C156S382000, C029S464000, C029S281100, C269S021000

Reexamination Certificate

active

06206069

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a method of surfacing at least one wide side of a substrate.
2. Background Art
In the art of manufacturing surfaced boards, such as particle boards laminated with a variety of different surfacing materials such as a decorative melamine layer, the sheet of surface lamination has usually been made larger than the board to be surfaced. The need for this practice has chiefly been caused by the inaccurate positioning systems used in lamination. Conventional laminating lines have not been able to align the core board and surface sheet stacks in constant positions in a repetitive manner. Consequently, the positioning of the surface sheets with respect to the boards has been hampered by alignment errors. Hence, complicated positioning systems have been employed to locate the surface sheet accurately with regard to the substrate board. Moreover, it has been necessary to trim away the excess surface sheet overlapping the edges of the substrate board. This requires an extra work step. The implementation of conventional lamination methods has therefore involved the use of complicated apparatuses. A further shortfall of the conventional art is the material loss due to the trimmed-off edges.
SUMMARY OF THE INVENTION
It is an object of the present invention to achieve a method of surfacing a board-like object by a surfacing material of sheet or web format in a manner capable of overcoming the drawbacks of prior-art methods.
The method according to the present invention offers a number of significant benefits. For instance, the method according to the invention makes it possible to locate the surfacing material and the substrate board accurately into desired positions irrespective of the initial position or alignment of the surfacing material and/or the board-like substrate. Therefore, the precise positioning of the surfacing material with respect to substrate such as a board avoids trimming waste of the surfacing material. The surfacing process thus becomes simpler and faster. Also the apparatus required to implement the method is less complicated. According to an embodiment of the invention, complicated control systems are not required. By virtue of using an elastic gripper means, the surfacing material and the substrate board can be located accurately against a backgage without any risk of damage to the surfacing material or the substrate board.
Further scope of applicability of the present invention will become apparent from the detailed description given hereinafter. However, it should be understood that the detailed description and specific examples, while indicating preferred embodiments of the invention, are given by way of illustration only, since various changes and modifications within the spirit and scope of the invention will become apparent to those skilled in the art from this detailed description.


REFERENCES:
patent: 4173275 (1979-11-01), Pfeiffer et al.
patent: 4336094 (1982-06-01), Mills
patent: 4367107 (1983-01-01), Valimont et al.
patent: 4861406 (1989-08-01), Baker et al.
patent: 5473406 (1995-12-01), Hassall et al.
patent: 5718791 (1998-02-01), Spengler
patent: 770444 (1977-10-01), None
patent: C54873 (1979-10-01), None

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