Method and apparatus for surface mounting terminals

Details Method and apparatus for surface mounting terminals Method and apparatus for surface mounting terminals

1987-02-05

1989-12-26

Ramsey, Kenneth J.

Metal fusion bonding

Process

Plural joints

228 62, 228 447, 228 491, B23K 3102

Patent

active

048892777

ABSTRACT:
A method and apparatus for surface mounting terminals on a substrate, in particular, pin terminals on a printed circuit board, having solder applied therein. In the first step of the method, a plurality of terminals are inserted in a holding fixture and held in alignment with each other. The holding fixture is then rotated to bring the terminals into contact with the solder on the substrate. In the next step of the method, the area of contact is heated, for example, by infra-red radiation, until reflow of the solder occurs. After heating, the heated solder is allowed to cool, i.e. solidify, thereby forming a secure connection between the terminals and the surface of the substrate.

REFERENCES:
patent: 3846905 (1974-11-01), Harper
patent: 3972463 (1976-08-01), Coulon et al.
patent: 3977075 (1976-08-01), Lynch et al.
patent: 4091529 (1978-05-01), Zaleckas
patent: 4311266 (1982-01-01), Kondo
patent: 4364508 (1982-12-01), Lazzery et al.
patent: 4654502 (1987-03-01), Furtek
"Component Attachment Method", IBM Technical Disclosure Bulletin, vol. 29, No. 7, Dec. 1986, pp. 2591-2952.

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