Method and apparatus for surface inspection

Optics: measuring and testing – Inspection of flaws or impurities – Surface condition

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356376, 25055941, G01N 2100

Patent

active

061151173

ABSTRACT:
A method and an apparatus, in which a light beam from a light source is provided on the surface of a semiconductor wafer through an optical system, a scattered light beam reflected from the surface of the semiconductor wafer is sensed, the semiconductor wafer and the optical system, in the meantime, are given a relative displacement with respect to each other, the foreign matter on the surface of the semiconductor wafer is inspected, and the position coordinates of the foreign matter are recorded. The height of the semiconductor wafer is measured when the foreign matter on the surface of the semiconductor wafer is inspected and the position coordinates of the foreign matter are corrected by utilizing the height signal of the semiconductor wafer.

REFERENCES:
patent: 4831274 (1989-05-01), Kohno et al.
patent: 4902131 (1990-02-01), Yamazaki et al.
patent: 5576831 (1996-11-01), Nikoonahad et al.
patent: 5715052 (1998-02-01), Fujino et al.

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