Method and apparatus for surface inspection

Details Method and apparatus for surface inspection Method and apparatus for surface inspection

1988-10-18

1990-12-04

Moore, David K.

Image analysis

Histogram processing

For setting a threshold

382 1, 382 51, 382 49, 358106, G06K 900

Patent

active

049759728

ABSTRACT:
Detection of a defect (18) on the surface (15) of an article (10), such as a semiconductor chip, is accomplished by illuminating the chip in a bright field and then capturing the image thereof with a television camera (30) coupled to a machine vision processor (32). To detect the defect 18, the vision processor first adaptively thresholds the captured image to effectively eliminate areas in the image brighter than those associated with the defect (18) which are usually dark. Thereafter, the vision processor (32) erodes and then dilates the dark areas within the image remaining after binarization to isolate those dark areas associated with the defect. The existence of a defect can then be established by the existence of a now-isolated dark area.

REFERENCES:
patent: 4601057 (1986-07-01), Tsuji et al.
patent: 4700225 (1987-10-01), Hara et al.
"An Automatic Wafer Inspection System Using Pipelined Image Processing Techniques," H. Yoda et al., published in the IEEE Transactions on Pattern Analysis and Machine Intelligence, vol. 10, No. 1, Jan. 1988.

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