Printing – Stenciling – Stencil and work support
Reexamination Certificate
2006-10-17
2006-10-17
Hirshfeld, Andrew H. (Department: 2854)
Printing
Stenciling
Stencil and work support
C101S127000, C101S129000, C118S213000
Reexamination Certificate
active
07121199
ABSTRACT:
A stencil printer for printing viscous material on a substrate includes a frame, a stencil coupled to the frame, and a print head, coupled for the frame, to deposit and print viscous material over the stencil. The stencil printer further includes a substrate supporting and clamping assembly to support and clamp a substrate in a print position. The substrate supporting and clamping assembly includes at least one support member to support the substrate in a print position, a pair of rail members, coupled to the frame, adapted to engage opposite edges of the substrate, and a clamping mechanism, coupled to the frame, to move at least one of the rail members against the substrate to clamp the substrate. The clamping mechanism includes at least one piston to move the at least one of the rail members between a first position in which the rail member is spaced away from one of the opposite edges of the substrate and a second position in which the rail member engages one of the opposite edges of the substrate to clamp the substrate between the rail members during a print operation. The clamping mechanism further includes a pressure regulator to control a clamping force applied by the piston to the rail member against the edge of the substrate. A method for supporting and clamping a substrate in a print position is further disclosed.
REFERENCES:
patent: 5092510 (1992-03-01), Anstrom et al.
patent: 5157438 (1992-10-01), Beale
patent: RE34615 (1994-05-01), Freeman
patent: 5707052 (1998-01-01), Adams et al.
patent: 5815912 (1998-10-01), Willshere et al.
patent: 5974654 (1999-11-01), Morita
patent: 6695298 (2004-02-01), Hertz et al.
patent: 6726195 (2004-04-01), Hertz et al.
patent: 2002/0020346 (2002-02-01), Doyle et al.
patent: 2002/0138977 (2002-10-01), Nagao et al.
patent: 2004/0142099 (2004-07-01), Rossmeisl et al.
patent: WO 03/006243 (2003-01-01), None
International Search Report for PCT/US2005/037199 dated Feb. 27, 2006.
Lynch James
Perault Joseph A.
Ferguson-Samreth Marissa
Hirshfeld Andrew H.
Lowrie Lando & Anastasi, LLP
Speedline Technologies, Inc.
LandOfFree
Method and apparatus for supporting and clamping a substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for supporting and clamping a substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for supporting and clamping a substrate will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3627739