Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-11-30
2011-12-20
Nguyen, Ha Tran T (Department: 2829)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S761000, C361S762000, C361S763000, C361S764000, C257S778000, C257S780000
Reexamination Certificate
active
08081484
ABSTRACT:
A printed circuit board assembly and method of assembly in which underfill is placed between a chip and substrate to support the chip. A trench is formed in the upper layer of the printed circuit board to limit the flow of the underfill and in particular to limit the underfill from contact with adjacent components so that the underfill does not interfere with adjacent components on the printed circuit board assembly.
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Ahmad Mudasir
Liu Kuo-Chuan
Nagar Mohan R.
Shanker Bangalore J.
Xue Jie
BainwoodHuang
Chi Suberr
Cisco Technology Inc.
Nguyen Ha Tran T
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