Method and apparatus for supporting a component on a substrate

Details Method and apparatus for supporting a component on a substrate Method and apparatus for supporting a component on a substrate

1995-06-16

2000-03-14

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29840, 257718, 257719, 437902, H05K 330

Patent

active

060355239

ABSTRACT:
A support is provided for a component on a substrate to minimize unacceptable bending or displacement. In a preferred embodiment, a suitable amount of a thermoplastic material is injected through a hole in a PCB under the component after the component has been affixed to the PCB. This allows the support material to fill any space between the component and the PCB yet allow for variation in lead height and for thermal expansion of the support material.

REFERENCES:
patent: 3649738 (1972-03-01), Anderson et al.
patent: 4521829 (1985-06-01), Wessely
patent: 5107330 (1992-04-01), Dahringer
patent: 5184211 (1993-02-01), Fox
patent: 5359768 (1994-11-01), Haley
IBM Tech Discl. Bull vol. 33 No. 2 pp 218-219, Jul. 1990.
IBM Tech Discl Bull vol. 33 No. 5 pp 246-252, Oct. 1990.

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