Method and apparatus for superplastic forming and diffusion bond

Metal fusion bonding – Process – With shaping

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

228118, 228193, 228243, 228 443, 219 7802, B23K 2000, B23K 2022, B23K 1900

Patent

active

049880373

ABSTRACT:
A method and apparatus for superplastic forming and diffusion bonding of hollow metal parts. A forming assembly is prepared by surrounding a hollow tool (typically having a frusto-conical exterior) with a part blank having a corresponding shape, attaching parts, such as rings, to the exterior of the blank, then surrounding those parts with a skin blank. The forming assembly is placed in a pressure chamber, a heater is placed within the assembly and the chamber is sealed. The assembly of parts is heated to the diffusion bonding temperature of the parts while subjecting them to high gas pressure. The skin blank is deformed into intimate contact with the adjacent surfaces of the other parts and all of the parts are diffusion bonded together at all interfaces to form a unitary product. Gas pressure is released and the product is cooled and removed from the chamber and hollow tool. Any desired finish machining is accomplished and the productive is complete.

REFERENCES:
patent: 3071853 (1963-01-01), Price et al.
patent: 3408728 (1968-11-01), Fickett et al.
patent: 3412917 (1968-11-01), Omley
patent: 3862489 (1975-01-01), Weisinger
patent: 3980220 (1976-09-01), Wolfe et al.
patent: 4087037 (1978-05-01), Schier et al.
patent: 4141483 (1979-02-01), Untilov et al.
patent: 4162758 (1979-07-01), Mikarai
patent: 4429824 (1984-02-01), Woodward

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method and apparatus for superplastic forming and diffusion bond does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for superplastic forming and diffusion bond, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for superplastic forming and diffusion bond will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-808835

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.