Method and apparatus for subjecting a workpiece to elevated pres

Details Method and apparatus for subjecting a workpiece to elevated pres Method and apparatus for subjecting a workpiece to elevated pres

1995-04-20

1996-05-21

Beck, Shrive

Coating processes

With post-treatment of coating or coating material

427350, 427294, 118 50, 118 501, B05D 304

Patent

active

055187714

ABSTRACT:
In order to subject a workpiece, such as a semiconductor wafer, to elevated pressures the workpiece is enclosed in a void (16) between two enclosure parts (6,7) which have been forced together by upper and lower actuators (12,13). The enclosure parts (6,7) are themselves enclosed in a vacuum chamber (1) evacuatable by a vacuum pumping system. Gas is then supplied from a suitable pressure source via a pipe (17) into void (10), thereby to subject the workpiece to elevated pressure. Heating means may be provided to permit the workpiece to be subject to elevated temperature.

REFERENCES:
patent: 3599601 (1971-08-01), Ishikawa et al.
patent: 4007706 (1977-02-01), Arvidsson
patent: 5194406 (1993-03-01), Bok et al.

Affiliated with

Also associated with

Rating

Method and apparatus for subjecting a workpiece to elevated pres does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for subjecting a workpiece to elevated pres, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for subjecting a workpiece to elevated pres will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2036245