Method and apparatus for subdividing into pieces a ceramic plate

Details Method and apparatus for subdividing into pieces a ceramic plate Method and apparatus for subdividing into pieces a ceramic plate

1984-12-07

1989-09-12

Yost, Frank T.

Severing by tearing or breaking

Methods

With preliminary weakening

225 4, 225 965, 225 97, B26F 300

Patent

active

048652415

ABSTRACT:
The invention provides a method and apparatus for breaking ceramic substrates which are used in the manufacture of hybrid electronic circuits. The substrate to be divided is subjected to a predetermined rigid deformation by means of two rigid dies having a circular cross-section with radii which differ. The centers of curvature of the circular cross-sections coincide when the dies are in their final position.

REFERENCES:
patent: 3396452 (1968-08-01), Sato et al.
patent: 3507426 (1970-04-01), Bielen et al.
patent: 3743148 (1973-07-01), Carlson
patent: 3786973 (1974-01-01), Bussman et al.
patent: 4247031 (1981-01-01), Pote et al.
Western Electric Technical Digest No. 60, Substrate Snapping Apparatus, J. F. Pollitt, Oct. 1980.

Affiliated with

Also associated with

Rating

Method and apparatus for subdividing into pieces a ceramic plate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for subdividing into pieces a ceramic plate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for subdividing into pieces a ceramic plate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-910170