Method and apparatus for stencil printing printed circuit boards

Details Method and apparatus for stencil printing printed circuit boards Method and apparatus for stencil printing printed circuit boards

1995-01-30

1996-09-10

Funk, Stephen R.

Printing

Stenciling

Traveling-inker machines

101126, 101129, 101484, 101486, 101DIG36, B41M 112, B41F 1512

Patent

active

055535380

ABSTRACT:
The method includes loading a printed circuit board (PCB) to a printing machine; aligning a stencil to the PCB when the PCB has been loaded to the printing machine; setting a snap-off distance; dispensing a volume of solder paste onto the stencil, the volume of solder paste being dispensed onto the stencil regardless of whether the PCB has been loaded to the printing machine; placing a squeegee in contact with the stencil at a predetermined pressure; moving the squeegee across the stencil at a predetermined speed; waiting a constant period of time; and repeating.

REFERENCES:
patent: 4872261 (1989-10-01), Sanyal et al.
patent: 4893556 (1990-01-01), Takahashi et al.
patent: 5001829 (1991-03-01), Schelhorn
patent: 5197655 (1993-03-01), Leerssen et al.
patent: 5232736 (1993-08-01), Tribbey et al.
patent: 5254362 (1993-10-01), Shaffer et al.
patent: 5261593 (1993-11-01), Casson et al.
patent: 5324569 (1994-06-01), Nagesh et al.
patent: 5339536 (1994-08-01), Buttars
patent: 5346118 (1994-09-01), Degani et al.

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