Method and apparatus for solvent bonding non-porous materials to

Details Method and apparatus for solvent bonding non-porous materials to Method and apparatus for solvent bonding non-porous materials to

1993-11-02

1995-10-24

Nicholson, Eric K.

Pipe joints or couplings

With assembly means or feature

Molded joint facilitator

285284, 285 22, 285423, F16L 1302

Patent

active

054604133

ABSTRACT:
An apparatus which creates a pre-engineered solvent bond is disclosed which acts to self-optimize the characteristics of the resultant solvent bond. These characteristics can thus be chosen by the part designer with confidence that inherent variations in the assembly process will not unduly impact the resultant bond. The design establishes a specific volume through integral tabs or removable shims within which solvent acts to precisely dissolve material so that the predetermined bond characteristics are automatically created without reliance upon assembler technique.

REFERENCES:
patent: 2301664 (1942-03-01), Eggert
patent: 2500053 (1950-03-01), Andrews
patent: 3920787 (1975-11-01), McDowell et al.
patent: 4047739 (1977-09-01), Aitken
patent: 4137117 (1979-01-01), Jones
patent: 4140324 (1979-02-01), Mulas et al.
patent: 4181549 (1980-01-01), McPhee
patent: 4256333 (1981-03-01), Jones
patent: 4417753 (1983-11-01), Bacehowski et al.
patent: 4426243 (1984-01-01), Briggs et al.
patent: 4512947 (1985-04-01), Wyle et al.
patent: 4595446 (1986-06-01), Newkirk et al.
patent: 4651382 (1987-03-01), Krolick et al.
patent: 4810318 (1989-03-01), Haisma et al.
patent: 4816107 (1989-03-01), Collins et al.
patent: 4822443 (1989-04-01), Dubowik
patent: 4842305 (1989-06-01), Kistenich
patent: 4846909 (1989-07-01), Klug et al.
patent: 5125431 (1992-06-01), Vogel et al.
patent: 5203943 (1993-04-01), Nornberg et al.
Malcolm W. Riley, "Joining & Fastening Plastics," Materials in Design Engineering, Jan. 1958, pp. 129-131.

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