Method and apparatus for soldering with a multiple tip and assoc

Electric heating – Metal heating – By arc

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2191216, 21912177, 228 11, B23K 2600

Patent

active

055651194

ABSTRACT:
A laser head for simultaneously attaching solder balls to a carrier has at least one solder tip, with the number of solder tips being equal to the number of solder balls to be attached to the carrier. Each solder tip is heated by an optical fiber in thermal contact with the tip at one end of the fiber and coupled to a laser, preferably operating in the infrared wavelength range, at the other end of the fiber via a multiplexer coupling device. A spring is used in association with each solder tip to bias each solder tip to hold the carrier in contact with the solder balls. The tip absorbs the radiant energy as it exits the optical fiber, and the tip is heated. The laser and multiplexer permit precise control over the heat imparted to the tip, which in turn permits control of the amount of the solder ball that is reflowed.

REFERENCES:
patent: 4534811 (1985-08-01), Ainslie et al.
patent: 4547652 (1985-10-01), Raisig et al.
patent: 4682001 (1987-07-01), Locke
patent: 4785156 (1988-11-01), Benko et al.
patent: 4792658 (1988-12-01), Langhans et al.
patent: 4843209 (1989-06-01), Milligan
patent: 4894509 (1990-01-01), Chalco et al.
patent: 4926022 (1990-05-01), Freedman
patent: 4945489 (1990-07-01), Vahab
patent: 4963714 (1990-10-01), Adamski et al.
patent: 4970365 (1990-11-01), Chalco
patent: 5021630 (1991-06-01), Benko et al.
patent: 5057969 (1991-10-01), Ameen et al.
"Novel Laser Soldering Process for Flex Circuit Attachment", IBM Tech. Bulletin, vol. 31, No. 3, Aug. 1988, pp. 206-207.
"Thermocouple Laser Sonic Bonder Tip", IBM Tech. Bulletin, vol. 33, No. 5, Oct. 1990.
Advertisement for Hobart Lasers & Advanced Systems "We're Flexible", Industrial Laser Review, Dec. 1993, p. 11.

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