Method and apparatus for soldering surface-mountable components

Details Method and apparatus for soldering surface-mountable components Method and apparatus for soldering surface-mountable components

1992-06-10

1993-05-18

Ramsey, Kenneth J.

Metal fusion bonding

Process

With measuring, testing, indicating, inspecting, or...

228 62, 2281802, B23K 300

Patent

active

052113256

ABSTRACT:
A method and apparatus for soldering surface-mountable components to a printed circuit board includes a soldering head have a suction pipette located in the center of a thermode with a rectangularly arranged set of soldering stirrups. The thermode and suction pipette are individually vertically moveable relative to one another for precise positioning of a surface-mountable component at a predetermined position on a printed circuit board. Soldering at a predetermined solder location with positional correctness is accomplished in a single work cycle.

REFERENCES:
patent: 4300715 (1981-11-01), Keizer et al.
patent: 4828162 (1989-05-01), Donner et al.
patent: 5033665 (1991-07-01), Todd
patent: 5094381 (1992-03-01), Amos et al.
patent: 5113581 (1992-05-01), Hidese
IBM Technical Disclosure Bulletin vol. 31 No. 5 Oct. 1988 pp. 20-22.

Affiliated with

Also associated with

Rating

Method and apparatus for soldering surface-mountable components does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for soldering surface-mountable components , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for soldering surface-mountable components will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-799250