Method and apparatus for soldering plate-shaped circuit carriers

Details Method and apparatus for soldering plate-shaped circuit carriers Method and apparatus for soldering plate-shaped circuit carriers

1984-03-14

1986-08-19

Godici, Nicholas P.

Metal fusion bonding

Process

Plural joints

228219, 228232, 228238, 228240, 228 37, B23K 3102

Patent

active

046064931

ABSTRACT:
The invention concerns preventing oxidation of printed circuit board metal surfaces as a result of heat produced in a solder bath arrangement and reducing thermal stress defects from occurring in the circuit carrier being soldered. An enclosed reaction chamber is provided with the solder bath and supplied with a pressurized atmosphere of inert gas which gas seals the reaction chamber from ambient air. The inert gas is discharged from jets against the solder side (the connector post side) of the printed circuit boards at a point upstream of the solder bath and the inert gas is at a temperature substantially higher than the solder bath temperature.

REFERENCES:
patent: 3136032 (1964-06-01), Berndsen
patent: 3386166 (1968-06-01), Tardoskegyi
patent: 3515330 (1970-06-01), Bronson et al.
patent: 3882596 (1975-05-01), Kendziora et al.
IBM Technical Disclosure Bulletin, vol. 11, No. 12, May 1969.

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