Method and apparatus for soldering option of a highly...

Details Method and apparatus for soldering option of a highly... Method and apparatus for soldering option of a highly...

2008-04-22

2008-04-22

Hyeon, Hae M (Department: 2839)

Electrical connectors

With insulation other than conductor sheath

Plural-contact coupling part

C439S083000, C439S946000

Reexamination Certificate

active

07361057

ABSTRACT:
A connector system for a miniaturized form factor card allows a communications system for mobile information devices having an applications processor and user interface components. A receiving frame is provided in the mobile information device for an insertable miniaturized form factor card incorporating means for RF transmission and reception and a wireless modem. A connector moiety on the card is received in a mating moiety in the receiving frame. The miniaturized form factor card also incorporates an array of solder pads for alternative permanent engagement of a mating array of solder pads on a printed circuit board in an alternative mobile information device. The applications processor and the user interface components in the mobile information device are interconnected to digital functions of the wireless modem and means for RF transmission and reception through the connector or, alternatively, the solder pad array.

REFERENCES:
patent: 6293464 (2001-09-01), Smalley, Jr.
patent: 6471550 (2002-10-01), Maiterth et al.
patent: 6690947 (2004-02-01), Tom
patent: 6719570 (2004-04-01), Tsuchioka
patent: 2007/0103876 (2007-05-01), Huang

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