Metal fusion bonding – Process – With measuring – testing – indicating – inspecting – or...
Patent
1997-02-28
1998-11-17
Ryan, Patrick
Metal fusion bonding
Process
With measuring, testing, indicating, inspecting, or...
228 565, 378 58, 378 62, G01B 1506, G01B 2304, B23K 3112
Patent
active
058365044
DESCRIPTION:
BRIEF SUMMARY
TECHNICAL FIELD
This invention is related to a method and an apparatus for soldering inspection of a surface mounted circuit board on which components are mounted by soldering. Especially, this invention is related to a method and an apparatus which inspect whether soldering condition is good or bad from a X-rays transmission image which is a result of radiating X-rays.
BACKGROUND ART
There is one prior method for inspecting whether soldering condition is good or bad concerning a circuit board-on which surfaces are mounted with components by soldering, which includes a radiating process for radiating X-rays towards a surface mounted circuit board, a detecting process for detecting a transmission amount of the radiated X-rays, an indicating process of indicating the transmission amount by a X-rays transmission image as a transmission amount distribution concerning different portions of the surface mounted circuit board, and an inspection process for inspecting whether soldering condition of the surface mounted circuit board is good or bad from the X-rays transmission image. It can be judged whether the soldering condition is good or bad since figure and solder amount of soldering portion can be detected from this X-rays transmission image. Thus, an information concerning X-rays transmission density is gained from such a X-rays transmission image, which corresponds to a shielding degree of X-rays which an radiated object has. The prior method applying the X-rays transmission image possesses a superior characteristic as a soldering inspection method.
However, with respect to a circuit board of which both side surfaces are mounted, it is impossible to inspect soldering conditions only from a X-rays transmission image. Because, the transmission images of the both side surfaces overlap each other.
Therefore, in order to settle this problem, one method and one apparatus for soldering inspection of a both-side surfaces mounted circuit board are proposed in Japanese Patent Laid Open 3-218409 and Japanese Patent Laid Open 5-99643, which apply X-rays transmission images.
Prior examples of a soldering inspection to the both-side surfaces mounted circuit board will be simply explained hereinafter, which are proposed in Japanese Patent Laid Open 3-218409 and Japanese Patent Laid Open 5-99643. Hereon, the both-side surfaces mounted circuit board means the circuit board of which both side surfaces should be mounted with components.
According to the method proposed in the above-mentioned Japanese Patent Laid Open 3-218409, an one-side X-rays transmission image is obtained and memorized. Hereon, the one-side X-rays transmission image means the X-rays transmission image concerning a state where one side surface of a both-side surfaces mounted circuit board is only mounted with components.
Next, a both-side X-rays transmission image is obtained. Hereon, the both-side X-rays transmission image means the X-rays transmission image concerning a state where both side surfaces of the both-side surfaces mounted circuit board are mounted with components.
And then, an other-side X-rays transmission image is extracted by subtracting the one-side X-rays transmission image from the both-side X-rays transmission image. Hereon, an other-side X-rays transmission image means the X-rays transmission image concerning a state where other side surface of a both-side surfaces mounted circuit board is only mounted with components.
Thus, the one-side X-rays transmission image and other-side X-rays transmission image are obtained respectively through the above mentioned processes. Accordingly, the one-side soldering condition and other-side soldering condition can be inspected from the one-side X-rays transmission image and other-side X-rays transmission image respectively.
According to the method proposed in the above-mentioned Japanese Patent Laid Open 5-99643, an one-side X-rays transmission image is obtained and memorized beforehand. And then, a both-side X-rays transmission image is obtained. Next, the one-side X-rays transmission image and
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Kakebayashi Yasunori
Koike Shiro
Mori Yoshikazu
Morita Yasuo
Nishijima Taro
Kabushiki Kaisha Kobe Seiko Sho
Knapp Jeffrey T.
Ryan Patrick
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