Method and apparatus for soldering elements on the corresponding

Metal fusion bonding – Means to apply vibratory solid-state bonding energy to work

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

228 62, 228237, 29740, 29840, B23K 2000, B23K 2010, B23K 2026

Patent

active

047338130

ABSTRACT:
An apparatus and method of the soldering or bonding of conductive leads to corresponding conductive pads of an integrated circuit chip includes a fixed soldering tool having a soleplate shaped to match the configuration of the pads, and a bench for supporting the chip. The bench is supported by a plurality of vertically moveable rods located with respect to the bench such that the longitudinal axes of the rods intersect the surface of the chip at predetermined fixed points which are located within a surface area of the chip bonded by a rectangular or square line long which the conductive pads are positioned. The movement of each of the rods is controlled by a corresponding actuator mechanism which enables each rod to be independently controlled. By appropriately controlling the movement of each rod, the bench can be made to tilt or oscillate with respect to its central point. In operation, the rods are controlled so as to move a chip carried on the bench into engagement with the fixed soleplate. Thereafter, the forces are applied to each rod so as to vary the force of contact between different groups of conductive pads and the soleplate. By appropriately controlling the forces applied to the rods, the force required for bonding of the conductive leads to the pads can be sequentially applied to different groups of pads, thereby minimizing the total force on the chip which would otherwise be necessary in order to bond simultaneously all of the conductive leads and pads.

REFERENCES:
patent: 3529759 (1970-09-01), Clark
patent: 3575333 (1971-04-01), Kulicke, Jr. et al.
patent: 3700156 (1972-10-01), Hermanns
patent: 3747829 (1973-07-01), Hofmeister
patent: 3938722 (1976-02-01), Kelly et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method and apparatus for soldering elements on the corresponding does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for soldering elements on the corresponding, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for soldering elements on the corresponding will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1084893

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.